Group Publications

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2019

  • H. Jia, H. Valavi, Y. Tang, J. Zhang, and N. Verma, "A Programmable Embedded Microprocessor for Bit-scalable In-memory Computing," IEEE HotChips: a symposium on high performance chips, Aug 2019. [slides] 
  • N. Verma, H. Jia, H. Valavi, Y. Tang, M. Ozatay, L. Y. Chen, B. Zhang, and P. Deaville, "In-memory Computing: advances and prospects," Solid-State Circuits Magazine, pp. 43-55, Aug. 2019. (invited) [paper]
  • Y. Mehlman, C. Wu, S. Wagner, N. Verma, and J. C. Sturm, “Gigherz-Zinc-Oxide TFT-Based Oscillators,” Device Research Conf. (DRC), June 2019. (Best Student Paper Award)
  • Z. Zheng, L. E. Aygun, Y. Mehlman, S. Wagner, N. Verma, and J. C. Sturm, “Analyzing and Increasing Yield of ZnO Thin-film Transistors for Large-area Sensing Systems by Preventing Process-Induced Gate Dielectric Breakdown,” Device Research Conf. (DRC), June 2019.
  • H. Valavi, P. Ramadge, E. Nestler, and N. Verma, “A 64-Tile 2.4-Mb In-Memory-Computing CNN Accelerator Employing Charge-Domain Compute,” IEEE J. of Solid-State Circuits (JSSC), vol. 54, no. 6, pp. 1789-1799, June 2019. [paper]
  • J. Zhang and N. Verma, “An In-memory-computing DNN Achieving 700TOPS/W and 6 TOPS/mm2in 130nm CMOS,” IEEE J. on Emerging and Selected Topics in Circuits and Systems (JETCAS),vol. 9, no. 2, pp. 358-366, June 2019. [paper] 
  • L. Y. Chen, S. Tao, andN. Verma, "A 3-D IC for Mitigating Energy of Memory Accessing and Data Movement in Accelerator-based Streaming Architectures," IEEE J. of Solid-State Circuits (JSSC), vol. 54, no. 6, pp. 1778-1788, June 2019. [paper]   
  • B. Zhang, L.-Y. Chen, and N. Verma, “Stochastic Data-Driven Hardware Resilience to Efficiently Train Inference Models for Stochastic Hardware Implementations,” Proc. IEEE Int’l Conf. on Acoustics, Speech and Signal Processing (ICASSP), May 2019. [paper]
  • L. Aygun, P. Kumar, Z. Zheng, T.-S. Chen, S. Wagner, J. C. Sturm, and N. Verma, “Hybrid System for Efficient LAE-CMOE Interfacing in Large-Scale Tactile-Sensing Skins via TFT-based Compressed Sensing,” Proc. IEEE Int’l Solid-State Circuits Conf. (ISSCC), Feb. 2019, pp. 280-281. [paper]
  • M. R. Pazhouhandeh, G. O’Leary, I. Weisspapir, D. Groppe, X.-T. Nguyen, K. Abdelhalim, H. M. Jafari, T. A. Valiante, P. Carlen, N. Verma, and R. Genov, “Adaptively Clock-boosted Auto-ranging Responsive Neurostimulator for Emerging Neuromodulation Applications,” Proc. IEEE Int’l Solid-State Circuits Conf. (ISSCC), Feb. 2019, pp. 374-375. [paper]
  • N. R. Shanbhag, N. Verma, Y. Kim, A. D. Patil and L. R. Varshney, "Shannon-Inspired Statistical Computing for the Nanoscale Era," Proc. of the IEEE (PIEEE), vol. 107, no. 1, pp. 90-107, Jan. 2019. [paper]

2018

  • H. Jia, Y. Tang, H. Valavi, J. Zhang, and N. Verma, “A Microprocessor implemented in 65nm CMOS with Configurable and Bit-scalable Accelerator for Programmable In-memory Computing,” arXiv: 1811.04047. [paper]
  • G. O’Leary, D. M. Groppe, T. A. Valiante, N. Verma, and R. Genov, “NURIP: Neural Interface Processor for Brain-State Classification and Programmable-waveform Neurostimulation,” IEEE J. of Solid-State Circuits (JSSC), vol. 52, no. 11, pp. 3150-3162, Nov. 2018. (invited) [paper]
  • M. Ozatay and N. Verma, “Exploiting Emerging Sensing Technologies Towards Structure in Data for Enhancing Perception in Human-centric Applications,” IEEE Internet of Things Journal, vol. 6, no. 2, pp. 3411-3422, Nov. 2018. [paper]
  • Y. Tang and N. Verma, “Energy-Efficient Pedestrian Detection System: exploiting statistical error compensation for lossy memory data compression,” IEEE Trans. on VLSI Systems (TVLSI), vol. 26, no. 7, pp. 1301-1311, July 2018.[paper]
  • Y. Tang, J. Zhang, and N. Verma, “Scaling Up In-memory-computing Classifiers via Boosted Feature Subsets in Banked Architectures,” IEEE Trans. on Circuits and Systems-II (TCAS-II), July 2018. DOI: 10.1109/TCSII.2018.2854759. [paper]
  • Y. Mehlman, P. Kumar, M. Ozatay, S. Wagner, J. C. Sturm, and N. Verma, “Large-Area Electronics HF RFID Reader Array for Object-Detecting Smart Surfaces,” IEEE Solid-State Circuits Letters, vol. 1, no. 8, pp. 182-185, Aug. 2018.
  • H. Valavi, P. Ramadge, E. Nestler, and N. Verma, “A Mixed-Signal Binarized Convolutional-Neural-Network Accelerator Integrating dense Weight Storage and Multiplication for Reduced Data Movement,” VLSI Symp. on Circuits (VLSIC), June 2018.[paper]
  • M. Gerber, C. Weaver, L. E. Aygun, N. Verma, J. C. Sturm, and B. Glisic, “Strain Transfer for Optimal Performance of Sensing Sheet,” Sensors, vol. 18, no. 6, June 2018.[paper]
  • M. Ozatay, L. Aygun, H. Jia, P. Kumar, Y. Mehlman, C. Wu, S. Wagner, J. C. Sturm, and N. Verma, "Artificial Intelligence Meets Large-scale Sensing: using Large-Area-Electronics (LAE) to enable intelligent spaces," to appear IEEE Custom Integrated Circuits Conf. (CICC). (invited)[paper]
  • G. O'Leary, M. R. Pazhouhandeh, M. Chang, D. Groppe, T. A. Valiante, N. Verma, R. Genov, "A Recursive-Memory Brain-State Classifierwith 32-Channel Track-and-Zoom Delta-Sigma ADCs and Charge-Balanced Programmable Waveform Neurostimulator," IEEE Int'l Solid-State Circuits Conf. (ISSCC), Feb. 2018, pp. 296-297. [paper]  
  • H. Jia and N. Verma, "Exploiting Approximate Feature Extraction via Genetic Programming for Hardware Acceleration in a Heterogeneous MIcroprocessr," IEEE J. Solid State Circuit (JSSC), preprint. (invited) [paper]
  • Y. Afsar, T. Moy, N. Brady, S. Wagner, J. C. Sturm, and N. Verma, "An Architecture for Large-Area Sensor Acquisition Using Frequency-Hopping ZnO TFT DCOs," IEEE J. Solid-State Circuits, (JSSC), vol. 53, no. 1, pp 297-308, Jan. 2018. (invited) [paper]

2017

  • Z. Wang and N. Verma, "A Low-Energy Machine-Learning Classifier Based on Clocked Comparators for Direct Inference on Analog Sensors," IEEE Trans. on Circuits and Systems (TCAS-I), vol. no. 11, pp. 2954-2965, Nov. 2017. [paper]
  • T. Moy, W. Rieutort-Louis, Y. Afsar, S. Wagner, J. C. Sturm, and N. Verma, “Hybrid Large-Area Sensing System Architectures for Broader Information Encoding” SRC TECHCON, Sept. 2017. (Best In Session Award) 
  • J. Lu, N. Verma, and N. K. Jha, "Genetic Programming for Energy-efficient and Energy-Scalable approximate Feature Computation in Embedded Inference Systems," IEEE Trans. on Comp. (TC), vol. 67, no. 2, pp. 222-236, Aug 2017. [paper]
  • Y. Mehlman, Y. Afsar, N. Verma, S. Wagner, and J. C. Sturm, "Self-Aligned ZnO Thin-Film Transistors with 860 MHz fT and 2 GHz fMAX for Large-Area Applications," IEEE Device Research Conf. (DRC), June 2017. [paper]
  • H. Jia, J. Lu, N. K. Jha, and N. Verma. "A Heterogeneous Microprocessor for Energy-scalable Sensor Inference Using Genetic Programming," IEEE VLSI Symp. on Circuits (VLSIC), June 2017. [paper]
  • T. Moy, W. Rieutort-Louis, L. Huang, S. Wagner, J. C. Sturm, and N. Verma, "Information-Processing-Driven Interfaces in Hybrid Large-Area Electronics Systems," IEEE Int'l Symp. on Circuits and Systems (ISCAS), May 2017. (invited) [paper]
  • S. Tao, R. M. Corey, A. C. Singer, and N. Verma, "A 10-b Statistical ADC Employing Pipelining and Sub-ranging in 32nm CMOS," IEEE Int'l Symp. on Circuits and Systems (ISCAS), May 2017. [paper]
  • J. Zhang, Z. Wang, and N. Verma, "In-Memory Computation of a Machine-Learning Classifier in a Standard 6T SRAM Array," IEEE J. of Solid-State Circuit (JSSC), vol. 52, no. 4, pp. 915-924, April 2017. (invited) [paper]  
  • S. Gopalakrishnan, T. Moy, U. Madhow, and N. Verma, "Compressive Information Acquisition with Hardware Impairements and Constraints: a case study," IEEE Int'l Conf. on Acoustics, Speech and Signal Processing (ICASSP), March 2017. [paper]
  • J. Sanz-Robinson, T. Moy, L. Huang, W. Rieutoprt-Louis, Y. Hu, S. Wagner, J. C. Sturm, and N. Verma, "Large-Area Electronics: A Platform for Next-Generation Human-Computer Interfaces," IEEE J. on Emerging and Selected Topics in Circuits and Systems (JETCAS), vol. 7, no. 1, pp. 38-49, March 2017. (invited) [paper]
  • Y. Mehlman, Y. Afsar, T. Moy, S. Wagner, J. C. Sturm, and N. Verma, "High-Speed Scanning Circuit Based on Metal-Oxide Thin-Film-Transistors for Reduction of Large-Area to CMOS IC Connections," Int'l Thin-film Transistor Conf. (ITC), Feb. 2017. [paper]
  • Y. Afsar, T. Moy, N. Brady, S. Wagner, J. C. Sturm, and N. Verma, "Large-Scale Acquisition of Large-Area Sensors Using an Array of Frequency-Hopping ZnO Thin-Film-Transistor Oscillators," IEEE Int'l Solid-State Circuits Conf. (ISSCC), Feb. 2017. [paper]
  • T. Moy, L. Huang, W. Rieutort-Louis, C. Wu, P. Cuff, S. Wagner, J. C. Sturm, and N. Verma, "An EEG Acquisition and Biomarker-Extraction System Using Low-Noise-Amplifier and Compressive-Sensing Circuits Based on Flexible, Thin-Film Electronics," IEEE J. of Solid-State Circuits (JSSC), vol. 52, no. 1, pp. 309-321, Jan. 2017. (invited) [paper]

2016

  • T. Moy, W. Rieutort-Louis, S. Wagner, J. C. Sturm, and N. Verma, "A Thin-film, Large-area Sensing and Compression System for Image Detection," IEEE Trans. on Circuits and Systems I (TCAS-I), Vol. 63, no. 11, pp. 1833-1844, Nov. 2016. [paper]
  • Z. Wang, J. Zhang, and N. Verma, "Reducing Quantization Errors for Inner-product Operations in Embedded Digital Signal Processing Systems," IEEE Signal Processing Magazine (SPM), vol. 33, no. 6, pp. 141-147, Nov. 2016. (invited) [paper]
  • N. Verma, L. Aygun, Y. Afsar, Y. Hu, L. Huang, T. Moy, J. Sanz Robinson, W. Rieutort-Louis, S. Wagner, and J. C. Sturm, "Hybrid Large-area Systems and their Interconnection Backbone," IEEE Networks on Chip (NoCs), Aug. 2016, DOI: 10.1109/NOCS.2016.7579342. (invited) [paper]
  • Y. Afsar, J. Tang, W. Rieutort-Louis, L. Huang, J. Sanz Robinson, N. Verma, S. Wagner, J. C. Sturm, "Impact of Bending on Flexible Metal Oxide TFTs and Oscillator Circuits," J. of. Soc. Info. Diplay (JSID), vol. 24, no. 6, pp. 371-381, June 2016. [paper]
  • J. Zhang, Z. Wang, and N. Verma, "A Machine-learning Classifier Implemented in a Standard 6T SRAM Array," IEEE VLSI Symp. on Circuits (VLSIC), June 2016, pp. C252-253. [paper]
  • B. Glisic, Y. Yao, S.-T. E. Tung, S. Wagner, J. C. Sturm, and N. Verma, "Strain Sensing Sheets for Structural Health Monitoring BAsed on LArge-Area Electronics and Integrated Circuits," Proc. of IEEE (PIEEE), preprint. (invited) [paper]
  • J. Lu, N. Verma, and N. K. Jha, "Compressed Signal Processing on Nyquist-sampled Signals," IEEE Trans. on Computers (TC), DOI: 10.1109/TC.2016.2532861. [paper]
  • Y. Afsar, J. Tang, W. Rieutort-Louis, L. Huang, Y. Hu, J. Sanz Robinson, S. Wagner, N. Verma, and J. C. Sturm, "Oxide TFT LC Oscillators on Glass and Plastic for Wireless Functions in Large-Area Flexible Electronic Systems," Society for Information Display Conf. (SID), May 2016. [paper]
  • T. Moy, S. Wagner, W. Rieutort-Louis, Y. Hu, L. Huang, J. Sanz Robinson, J. C. Sturm, and N. Verma, "Hybrid LArge-Area Systems: challenges in interfacing," IEEE Int'l Symp. on Circuits and Systems (ISCAS), May 2016. (invited) [paper]   
  • J. Sanz Robinson, L. Huang, T. Moy, W. Rieutort-Louis, Y. Hu, S. Wagner, J. C. Sturm, and N. Verma, "Large-area Microphone Array for Audio Source Separation Based on a Hybrid Architecture Exploiting Thin-film electronics and CMOS," IEEE J. Solid-State Circuits (JSSC), vol. 51, no. 4, pp. 979-991, April 2016. (invited) [paper]
  • J. Sanz Robinson, L. Huang, T. Moy, W. Rieitort-Louis, Y. Hu, S. Wagner, J. C. Sturm, and N. Verma, "Robust Blind Source Separation in a Reverberant Room Based on Beamforming with a Large-Aperture Microphone Array," IEEE Int'l Conf. on Acoustics, Speech and Signal Processing (ICASSP), March 2016, pp. 440-444. [paper
  • T. Moy, L. Huang, W. Rieutort-Louis, S. Wagner, J.  C. Sturm, and N. Verma,"A Flexible EEG Acquisition and Biomarker Extraction System Based on Thin-Film Electronics," IEEE Int'l Solid-State Circuits Conf. (ISSCC), Feb. 2016, pp. 294-295. [paper]
  • W. Rieutort-Louis, T. Moy, Z. Wang, S. Wagner, J. C. Sturm, and N. Verma, "A Large-Area Image Sensing and Detection System Based on Embedded Thin-Film Classifiers," IEEE J. Solid-State Circuits (JSSC), vol. 51, no. 1, pp. 281-290, Jan. 2016. (invited) [paper]

2015

  • Z. Wang, J. Zhang, and N. Verma, "Realizing Low-Energy Classification Systems by Implementing Matrix Multiplication Directly Within an ADC," IEEE Trans. on Biomedical Circuits and Systems (TBioCAS), vol. 9, no. 6, pp. 825-837, Dec. 2015. (invited) [paper]
  • N. Verma, Z. Wang, and J. Zhang, "A Look at Signal Analysis in Resource-constrained Medical-sensor Applications," IEEE Biomedical Circuits and Systems Conference (BioCAS), Oct. 2015. (invited) [paper]
  • J. Zhang, L. Huang, Z. Wang, and N. Verma, "A Seizure-detection IC Employing Machine Learning to Overcome Data-conversion and Analog-processing Non-idealities," IEEE Custom Integrated Circuits Conference (CICC), Sept. 2015[paper]
  • W. Rieutort-Louis, J. Sanz-Robinson, T. Moy, L. Huang, Y. Hu, Y. Afsar, J. C. Sturm, N. Verma, S. Wagner, "Integrating and Interfacing Flexible Electronics in Hybrid Large-Area Systems," IEEE Trans. Components, Packaging and Manufacturing Technology (TCPMT), vol. 5, no. 9, pp. 1219-1229, Sept. 2015. (invited) (Best Paper Award) [paper]  
  • L. Huang, J. Sanz Robinson, T. Moy, Y. Hu, W. Rieutort-Louis, S. Wagner, J. C. Sturm, and N. Verma, "Reconstruction of Multiple-user Voice Commands using a Hybrid System Based on Thin-film Electronics and CMOS," VLSI Symp. on Circuits (VLSIC), June 2015, pp. C196-C197. [paper
  • S. Tao, E. Abbe, and N. Verma,"Statistical ADC Enhanced by Pipelining and Sub-ranging," IEEE Trans. Circuits and Systems II (TCAS-II), vol. 62, no. 6, pp. 538-542, June 2015. [paper]
  • Z. Wang and N. Verma, "Reducing Quantization Error in Low-energy FIR Filter Accelerators," Int'l Conf. on Acoustics, Speech and Signal Processing (ICASSP). [paper]
  • L. Huang, W. Rieutort-Louis, A. Gualdino, L. Teagno, Y. Hu, J. Mouro, J. Sanz Robinson, J. C. Sturm, S. Wagner, V. Chu, J. P. Conde, and N. Verma, "A System Based  on Capactive Interfacing od CMOS with Post-processed Thin-film MEMS Resonators Employing Synchrounous Readout for Parasitic Nulling," IEEE J. Solid-State Circuits (JSSC), vol. 50, no. 4, pp. 1002-1015, April 2015. (invited) [paper]
  • N. Verma, Y. Hu, L. Huang, W. Rieutort-Louis, J. Sanz Robinson, T. Moy, B. Glisic, S. Wagner, J. C. Sturm, "Enabling Scalable Hybrid Systems: architectures for exploiting large-area electronics in applications," Proc. of IEEE, vol. 103, no. 4, pp. 690-712, April 2015. (invited) [paper
  • Z. Wang, R. Schapire, and N. Verma, "Error Adaptive Classifier Boosting (EACB): Leveraging Data-Driven Training Towards Hardware Resilience for Signal Inference," IEEE Trans. Circuits and Systems I (TCAS-I), vol. 62, no. 4, pp. 1136-1145, April 2015. [paper]
  • T. Moy, W. Rieutort-Louis, J. C. Sturm, S. Wagner, and N. Verma, "TFT-based Calibration Circuit for Thin-film Photoconductors," Int'l Thin-Film Transistor Conf. (ITC), Feb. 2015.
  • W. Rieutort-Louis, R. Shidachi, Y. Afsar, J. C. Sturm, N. Verma, T. Someya, and S. Wagner, "Representative Flicker Noise Measurements for Low-temperature Amorphous Silicon, Organic, and Zinc Oxide Thin-film Transistors," Int'l Thin-Film Transistor Conf. (ITC), Feb. 2015.
  • J. Zhang, Z. Wang, and N. Verma, " A Matrix-Multiplying ADC Implementing a Machine-Learning Classifier Directly with Data Conversion," Int'l Solid-State Circuits Conf. (ISSCC), Feb. 2015, pp. 332-333. [paper]
  • W. Rieutort-Louis, T. Moy, Z. Wang, S. Wagner, J. C. Sturm, and N. Verma, "A Large-area Image Sensing and Detection System Based on Embedded Thin-film Classifiers," Int'l Solid-State Circuits Conf. (ISSCC), Feb. 2015, pp. 292-293. [paper]
  • Z. Wang, K. H. Lee, and N. Verma, "Hardware Specialization in Low-power Applications to Address Energy and Resilience," J. Signal Processing Systems, vol. 78, no. 1, pp. 49-62, Jan. 2015. (invited) [paper]

2014

  • Z. Wang and N. Verma, "Enabling Hardware Relaxations through Statistical Learning," to appear Allerton Conf. on Communication, Control and Computing, Oct. 2014, pp. 319-326. [paper]
  • Z. Wang, K. H. Lee, and N. Verma, "Overcoming Computational Errors in Sensing Platforms through Embedded Machine-learning Kernels," IEEE Trans. VLSI Systems (TVLSI). [paper]
  • Y. Hu, T. Moy, L. Huang, W. Rieutort-Louis, J. Sanz Robinson, S. Wagner, J. C. Sturm, and N. Verma, "3D Multi-gesture Sensing System for Large Areas based on Pixel Self-capacitance Readout using TFT Scanning and Frequency-conversion Circuits," Custom Integrated Circuits Conference (CICC), Sept. 2014. [paper]
  • W. Rieutort-Louis, L. Huang, Y. Hu, J. Sanz-Robinson, T. Moy, Y. Afsar, J. C. Sturm, N. Verma, and S. Wagner, "Characterization of Cutoff Frequency in Amourphous Silicon Thin-film Transistors," to appear Device Research Conference (DRC).
  • T. Moy, W. Rieutort-Louis, Y. Hu, L. Huang, J. Sanz-Robinson, J. C. Sturm, S. Wagner, and N. Verma, "Thin-film Circuits for Scalable Interfacing Between Large-area Electronics and CMOS ICs," to appear Device Research Conference (DRC).
  • L. Huang, W. Rieutort-Louis, A. Gualdino, L. Teagno, Y. Hu, J. Mouro, J. Sanz-Robinson, J. C. Sturm, S. Wagner, V. Chu, J. Conde, and N. Verma, "An ASIC for Readout of Post-processed Thin-film MEMS Resonantors by Employing Capacitive Interfacing and Active Parastic Cancellation," VLSI Symp. on Circuits (VLSI), June 2014. [paper]
  • Z. Wang, R. Schapire, and N. Verma, "Error-Adaptive Classifier Boosting (EACB): exploiting data-driven training for highly fault-tolerant hardware," IEEE Int'l Conf. on Acoustics, Speech and Signal Processing (ICASSP), May 2014. [paper]
  • J. Sanz-Robinson, W. Rieutort-Louis, Y. Hu, L. Huang, N. Verma, S. Wagner, and J. C. Sturm, "Hybrid Amorphous / Nanocrystalline Silicon Schottky Diodes for High Frequency Rectification," IEEE Electron Device Letters, vol. 35, no. 4, pp. 425-427, April 2014. [paper]
  • M. Shoaib, N. K. Jha, and N. Verma, "Signal Processing with Direct Computations on Compressively-sensed Data," IEEE Trans. VLSI Systems (TVLSI). [paper]
  • Y. Hu, L. Huang, W. Rieutort-Louis, J. Sanz Robinson, J. C. Sturm, S. Wagner, and N. Verma, "Self-powered System for Large-scale Strain Sensing by Combining CMOS ICs with Large-area Electronics," IEEE J. of Solid-State Circuits (JSSC), vol. 49, no. 4, pp. 838-850, April 2014. (invited) [paper]
  • M. Shoaib, K. H. Lee, N. K. Jha, and N. Verma, "A 0.6-107 uW Energy-scalable Processor for Directly Analyzing Compressively-sensed EEG," IEEE Trans. Circuits and Systems I (TCAS-I), vol. 61, no. 4, pp. 1105-1118, April 2014. [paper]
  • Y. Hu, W. Rieutort-Louis, J. Sanz Robinson, L. Huang, B. Glisic, J. C. Sturm, S. Wagner, and N. Verma, "Large-scale Sensing System Combining Large-area Electronics and CMOS ICs for Structural Health Monitoring," IEEE J. of Solid-State Circuits (JSSC), vol. 49, no. 2, pp. 513-523, Feb. 2014. [paper]
  • Y. Hu, L. Huang, W. Rieutort-Louis, J. Sanz Robinson, S. Wagner, J. C. Sturm, and N. Verma, "3D Gesture Sensing System for Interactive Displays Based on Extended-range Capacitive Sensing," Int'l Solid-State Circuits Conf. (ISSCC), Feb. 2014. [paper]

2013

  • W. Rieutort-Louis, L. Huang, Y. Hu, J. Sanz Robinson, S. Wagner, J. C. Sturm, and N. Verma, "A Complete Fully Thin-film PV Harvesting and Power-management System on Plastic with On-sheet Battery Management and Wireles Power Delivery to Off-sheet Loads," IEEE J. of Photovoltics (J-PV), vol. 4, no. 1, pp. 432-439, Oct. 2013. (invited) [paper]
  • K. H. Lee, Z. Wang, and N. Verma, "Hardware Specialization of Machine-learning Kernels: possibilities for applications and possibilities for the platform design space," IEEE Workshop on Signal Processing Systems (SiPS), Oct. 2013. (invited) [paper]
  • Y. Hu, L. Huang, J. Sanz Robinson, W. Rieutort-Louis, S. Wagner, J. C. Sturm, and N. Verma, "Energy Harvesting and Power Management for Sensing Skins in SHM Applications," Int'l Workshop on Structural Health Monitoring (IWSHM), Sept. 2013. [paper]
  • W. Rieutort-Louis, J. Sanz Robinson, Y. Hu, L. Huang, J. C. Sturm, N. Verma, S. Wagner, "Readout from TFT Current-based Sensors Over Non-contact Interfaces using a TFT Gilbert-type Modulator,"  Int'l Conf. on Amorphous and Nano-crystalline Semiconductors (ICANS), Aug. 2013.
  • J. Sanz Robinson, W. Rieutort-Louis, Y. Hu, L. Huang, N. Verma, S. Wagner, and J. C. Sturm, "High Current Density, Hybrid Nanocrystalline / Amorphous Silicon Schottky Diodes," Int'l Conf. Amorphous and Nano-crystalline Semiconductors (ICANS), Aug. 2013.
  • K. H. Lee and N. Verma, "A Low-power Processor with Configurable Embedded Machine-learning Accelerators for High-order and Adaptive Analysis of Medical-sensor Signals," J. of Solid State Circuits (JSSC), vol. 48, no. 7, pp. 1625-1637, July 2013. (invited) [paper]
  • W. Rieutort-Louis, L. Huang, Y. Hu, J. Sanz Robinson, S. Wagner, J. C. Sturm, and N. Verma, "A Complete fully Thin-film PV Harvesting and Power-management System on Plastic with On-sheet Battery Management and Wireless Power delivery to Off-sheet Loads," IEEE Photovoltaic Specialist Conf. (PVSC), June 2013.
  • Y. Hu, L. Huang, J. Sanz Robinson, W. Rieutort-Louis, S. Wagner, J. C. Sturm, and N. Verma, "A Fully Self-powered Hybrid System Based on CMOS ICs and Large-area Electronics for Large-scale Strain Monitoring," VLSI Symp. Circuits (VLSI), June 2013. [paper(Best Student Paper Award)
  • K. H. Lee and N. Verma, "A Low-power Microprocessor for Data-driven Analysis of Analytically-intractable Physiological Signals in Advanced Medical Sensors," VLSI Symp. Circuits (VLSI), June 2013. [paper]
  • M. Mannoor, Z. Jiang, T. James, Y. L. Kong, K. A. Malatesta, W. O. Soboyejo, N. Verma, D. H. Gracias, and M. C. McAlpine, "3D Printed Bionic Ears," Nano Letters, pp. 2634-2639, May 2013. [paper]
  • W. Rieutort-Louis, Y. Hu, L. Huang, J. Sanz Robinson, S. Wagner, N. Verma, and J. C. Sturm, "Effect of Low-Temperature TFT Processing on Power Delivery from Thin-Film Power Electronics on Flexible Substrates," Materials Research Society Meeting (MRS), April 2013.
  • J. Sanz Robinson, Y. Hu, W. Rieutort-Louis, L. Huang, N. Verma, S. Wagner, and J. C. Sturm, "Hybrid Nanocrystalline/Amorphous-silicon Schottky Diodes for Large-area Electronic Systems," Materials Research Society Meeting (MRS), April 2013. 
  • L. Huang, W. Rieutort-Louis, Y. Hu, J. Sanz-Robinson, S. Wagner, J. C. Sturm, and N. Verma, "A Super-regenerative Radio on Plastic Based on Thin-film Transistors and Antennas on Large Flexible Sheets for Distributed Communication Links," Int. Solid State Circuits Conf. (ISSCC), Feb. 2013. [paper]

2012

  • W. Rieutort-Louis, J. Sanz-Robinson, Y. Hu, L. Huang, J. C. Sturm, N. Verma, and S. Wagner, “Device Optimization for Integration of Thin-Film Power Electronics with Thin-film Energy-harvesting Devices to Create Power-delivery Systems on Plastic Sheets,” Int. Electron Device Meeting (IEDM), Dec. 2012. [paper]
  • M. Shoaib, N. Jha, and N. Verma, "Algorithm-Driven Architectural Design Space Exploration of Domain-Specific Medical-Sensor Processors," IEEE Trans. Very Large Scale Integration (T-VLSI), online Oct. 2013. [paper]
  • K. H. Lee and N. Verma, “A 1.2-0.55V General-purpose Biomedical Processor with Configurable Machine-learning Accelerators for High-order, Patient-adaptive Monitoring,” European Solid State Circuits Conf. (ESSCIRC), Sept 2012. [paper]
  • S. Mohammed, N. K. Jha, and N. Verma, “A Compressed-domain Processor for Seizure Detection to Simultaneously Reduce Computation and Communication Energy,” Custom Integrated Circuits Conf. (CICC), Sept. 2012. [paper]
  • Y. Hu, W. Rieutort-Louis, L. Huang, J. Sanz-Robinson, S. Wagner, J. Sturm, and N. Verma, “Flexible Solar-Energy Harvesting System on Plastic with Thin-film LC Oscillators Operating Above ft  for Inductively-coupled Power Delivery,” Custom Integrated Circuits Conf. (CICC), Sept. 2012. [paper]
  • J. Sanz-Robinson, W. Rieutort-Louis, N. Verma, S. Wagner, and J. Sturm, “Frequency Dependence of Amorphous Silicon Schottky Diodes for Large-Area Rectification Applications” Device Research Conf. (DRC), June 2012.
  • W. Rieutort-Louis, L. Huang, Y. Hu, J. Sanz-Robinson, S. Wagner, J. Sturm, and N. Verma, “Figure of Merit for Oscillator-based Thin-film Circuits on Plastic for High-performance signaling, Energy Harvesting and Driving of Actuation Circuits,” Device Research Conf. (DRC), June 2012. [paper]
  • Y. Hu, W. Rieutort-Louis, J. Sanz-Robinson, K. Song, J. Sturm, S. Wagner, and N. Verma, “High-resolution Sensing Sheet for Structural-health Monitoring via Scalable Interfacing of Flexible Electronics with High-performance ICs,” VLSI Symp. Circuits (VLSI), June 2012. [paper]
  • L. Huang, W. Rieutort-Louis, Y. Hu, J. Sanz-Robinson, S. Wagner, J. Sturm, and N. Verma, “Integrated All-silicon Thin-film Power Electronics on Flexible Sheets For Ubiquitous Wireless Charging Stations based on Solar-energy Harvesting, ”VLSI Symp. Circuits (VLSI), June 2012. [paper]
  • W. Rieutort-Louis, J. Sanz-Robinson, J. C. Sturm, S. Wagner, and N. Verma, “Thin-film Transistors and Circuit-design Styles for Scalable Control and Access Functionality over Sensor Arrays on Plastic,” Materials Research Society Meeting (MRS), April 2012. [paper]
  • J. Sanz-Robinson, W. Rieutort-Louis, N. Verma, S. Wagner, and J. C. Sturm, “A Full-wave Bridge Rectifier Based on Thin-film Amorphous-silicon Schottky Diodes for Wireless Power and Signal Transfer in Systems-on-plastic,” Materials Research Society Meeting (MRS), April 2012.
  • T. Moy, Y. Wong, C. Galaiya, S. Archibald, B. Pesaran, N. Verma, and S. Wagner, “Flexible Microelectrode Arrays with Dural Regeneration for Chronic Neural Recording,” Materials Research Society Meeting (MRS), April 2012. [poster]
  • K. H. Lee, S.-Y. Kung, N. Verma, “Low-energy Formulations of Support Vector Machine Kernel Functions for Biomedical Sensor Applications” J. Signal Processing Systems (JSPS), April 2012 (online). [paper]
  • N. Verma, K. H. Lee, K. Jang, and A. Shoeb, “Enabling System-level Platform Resilience Through Embedded Data-driven Inference Capabilities in electronic Devices,” IEEE Int. Conf. on Acoustics, Speech and Signal Processing (ICASSP), March 2012. (invited) [paper]
  • S. Mohammed, N. K. Jha, and N. Verma, “Enabling Advanced Inference on Sensor Nodes Through Direct Use of Compressively-sensed Signals,” Design Automation and Test in Europe (DATE), March 2012[paper]
  • M. Mannoor, H. Tao, J. Clayton, A. Sengupta, D. Kaplan, R. Naik, N. Verma, F. Omenetto, M. McAlpine, “Graphene-based Wireless Bacteria Detection on Tooth Enamel,” Nature Comm., March 2012. [paper]

2011

  • B. Glisic and N. Verma, “Sensing sheet for SHM based on Large Area Electronics,” 5th Int. Conf. Structural Health Monitoring of Intelligent Infrastructure, Dec. 2011.
  • B. Glisic and N. Verma, “Very dense arrays of sensors for SHM based on Large Area Electronics,” 8th Int. Workshop on Structural Health Monitoring, Sept. 2011.
  • S. Mohammed, N. K. Jha, N. Verma, “Sub-threshold Computational Circuits for High-order Data-driven Analysis of Physiological Signals” IEEE Subthreshold Microelectronics Conference, Sept. 2011. [paper]
  • K. H. Lee, K. Jang, A. Shoeb, and N. Verma, “A Data-driven Modeling Approach to Stochastic Computation for Low-energy Biomedical Devices,” IEEE Annual Int. Conf. EMBS (EMBC), Boston, MA, Aug. 2011. [paper]
  • K. Jang, G. Balakrishnan, Z. Syed, and N. Verma, “Scalable Customization of Atrial Fibrillation Detection in Cardiac Monitoring Devices: Increasing Detection Accuracy through Personalized Monitoring in Large Patient Populations,” IEEE Annual Int. Conf. EMBS (EMBC), Boston, MA, Aug. 2011. [paper]
  • S. Mohammed, N. Jha, and N. Verma, “A Low-Energy Computation Platform for Data-Driven Biomedical Monitoring Algorithms”, Design Automation Conference (DAC), San Diego, CA, June, 2011. [paper]
  • K. H. Lee, S.-Y. Kung, and N. Verma, “Improving Kernel-Energy Trade-offs for Machine Learning  in Implantable and Wearable Biomedical Applications,” IEEE Int. Conf. Acoustics, Speech and Signal Processing (ICASSP), Prague, Czech Republic, May, 2011. [paper
  • A. Miller, .., and N. Verma, “Microelectrode Arrays Employing Collagen for Improved Neuronal Recording,” Materials Research Society Meeting (MRS), San Francisco, CA, April, 2011. [poster]
  • N. Verma, K. H. Lee, A. Shoeb, “Data-driven Approaches for Computation in Intelligent Biomedical Devices: A Case Study of EEG Monitoring for Chronic Seizure Detection,” Journal of Low Power Electronics and Applications, April 2011. [paper]
  • N. Verma, “Analysis Towards Minimization of Total SRAM Energy Over Active and Idle Operating Modes,” IEEE Tran. VLSI Systems, Dec. 2010 (online), Sept. 2011. [paper]

2010

  • N. Verma, “Intelligent Patient Monitoring: the sensing and computation challenges for low-power electronics,” CMOS Emerging Technologies (CMOSET), Whistler, Canada, May, 2010.
  • N. Verma, A. Shoeb, J. Bohorquez, J. Dawson, J. Guttag, A. P. Chandrakasan, "A Micro-Power EEG Acquisition SoC With Integrated Feature Extraction Processor for a Chronic Seizure Detection System," IEEE Journal of Solid-State Circuits (JSSC), April 2010. [paper]
  • A.P. Chandrakasan, D.C. Daly, D.F. Finchelstein, J. Kwong, Y.K. Ramadass, M.E. Sinangil, V. Sze, N. Verma, “Technologies for Ultra-Dynamic Voltage Scaling,” Proceedings of  the IEEE, Feb. 2010. [paper]

2009

  • M.E. Sinangil, N. Verma, and A. Chandrakasan, “A 45nm 0.5V 8T Column-Interleaved SRAM with on-Chip Reference Selection Loop for Sense-Amplifier,” Asian Solid –State Circuits Conference (A-SSC), Taipei, Taiwan, Nov. 2009. [paper]
  • M.E. Sinangil, N. Verma, A.P. Chandrakasan, “A Reconfigurable Ultra-Dynamic Voltage Scalable (U-DVS) SRAM in 65nm”, IEEE J. Solid-State Circuits (JSSC), Nov. 2009. [paper]
  • N. Verma, A. Shoeb, J. Guttag, and A. Chandrakasan, “A Micro-power EEG Acquisition SoC with Integrated Seizure Detection Processor for Continuous Patient Monitoring,” VLSI Symp. on Circuits (VLSI), Kyoto, Japan, June 2009. [paper]
  • N. Verma, and A. P. Chandrakasan, “A High-Density 45nm SRAM Using Small-Signal Non-Strobed Regenerative Sensing,” IEEE J. Solid-State Circuits, ISSCC Special Issue (JSSC), Jan. 2009. [paper]
  • J. Kwong, Y. Ramadass, N. Verma, and A. Chandrakasan, “A 65nm Sub-Vt Microcontroller with Integrated SRAM and Switch Capacitor DC-DC Converter,” IEEE J. Solid-State Circuits, ISSCC Special Issue (JSSC), Jan 2009. [paper]

2008

  • M.E. Sinangil, N. Verma, and A. Chandrakasan, “A Reconfigurable 65nm SRAM Achieving Voltage Scalability from 0.25-1.2V and Performance Scalability from 20kHz-200MHz,” European Solid –State Circuits Conference (ESSCIRC), Edinburgh, Scotland, Sept. 2008. [paper]
  • A.P. Chandrakasan, N. Verma, and D. Daly, “Ultra Low Power Electronics for Biomedical Applications,” Annual Review of Biomedical Engineering, Aug. 2008. [paper]
  • N. Verma, D. Daly, N. Ickes, J. Kwong, B. Ginsburg, Y. Ramadass, V. Sze, and A. Chandrakasan, “Low-Voltage System Design for Highly Energy-Constrained Applications,” Faible Tension Faible Consommation (FTFC), Louvain-la-Neuve, Belgium, May 2008. [presentation
  • N. Verma and A. P. Chandrakasan, “A High-Density 45nm SRAM Using Small-Signal Non-Strobed Regenerative Sensing,” IEEE ISSCC Dig. Tech. Papers, San Francisco, CA, Feb. 2008. [paper]
  • J. Kwong, Y. Ramadass, N. Verma, M. Koesler, K. Huber, H. Moormann, and A. Chandrakasan, “A 65nm Sub-VtMicrocontroller with Integrated SRAM and Switch Capacitor DC-DC Converter,” IEEE ISSCC Dig. Tech. Papers, San Francisco, CA, Feb. 2008. [paper]
  • N. Verma and A. P. Chandrakasan, “A 65nm 8T Sub-Vt SRAM Employing Sense-Amplifier Redundancy,” IEEE J. Solid-State Circuits, ISSCC Special Issue (JSSC), Jan. 2008. [paper]                           
  • N. Verma, J. Kwong and A. P. Chandrakasan, “Nanometer MOSFET Variation in Minimum Energy Sub-Threshold Circuits,” IEEE Trans. Elect. Devices (T-ED), Jan. 2008. [paper]

2007

  • A. Wang, B. H. Calhoun, N. Verma, J. Kwong, and A. Chandrakasan, “Ultra-Dynamic Voltage Scaling for Energy Starved Electronics,” Proc. of GOMAC Tech, March 2007.
  • N. Verma and A. P. Chandrakasan, “An Ultra Low Energy 12-bit Rate-Resolution Scalable SAR ADC for Wireless Sensor Nodes,” IEEE J. Solid-State Circuits (JSSC), June 2007. [paper]
  • N. Verma and A. P. Chandrakasan, “A 65nm 8T Sub-Vt SRAM Employing Sense-Amplifier Redundancy,” IEEE ISSCC Dig. Tech. Papers, San Francisco, CA, Feb. 2007. [paper]

2006

  • B. H. Calhoun, A. Wang, N. Verma, and A. P. Chandrakasan, “Sub-threshold Design: The Challenges of Minimizing Circuit Energy,” IEEE ISLPED Dig. Tech. Papers, Tegernsee, Germany, pp. 366-368, Oct. 2006. [paper]
  • A. P. Chandrakasan, N. Verma, J. Kwong, D. Daly, N. Ickes, D. Finchelstein, and B. H. Calhoun, “Micropower Wireless Sensors,” NSTI Nanotech, vol. 3, pages 459-462, May 7-11, 2006. [paper]
  • N. Verma and A. P. Chandrakasan, “A 25μW 100kS/s 12b ADC for Wireless Micro-Sensor Applications,” IEEE ISSCC Dig. Tech. Papers, San Francisco, CA, Feb. 2006. [paper]

2005

  • B. H. Calhoun, D. C. Daly, N. Verma, D. F. Finchelstein, D. D. Wentzloff, A. Wang, S.-H. Cho, and A. P. Chandrakasan, “Design Considerations for Ultra-Low Energy Wireless Microsensor Nodes,” IEEE Transactions on Computers, June 2005. [paper]